Kandou is a global leader in high-speed, energy efficient, chip-to-chip link solutions critical to the evolution of the electronics industry.
Kandou enables a better-connected world by offering disruptive technology through licensing and standard products that empower the devices we use every day to become smaller, more energy efficient and more cost effective.
Kandou was founded in 2011 by Amin Shokrollahi. The company is headquartered in Lausanne, Vaud, Switzerland, with additional offices in UK and Germany.
Kandou's technology specializes in the invention, design, license and implementation of unmatched chip-to-chip link solutions.
Kandou has a strong IP portfolio including Chord™ signaling, adopted into industry specifications by JEDEC and the OIF. Kandou’s innovations and implementations deliver a fundamental advance in interconnect technology that lowers the power consumed and improves the performance of chip links, unlocking new capabilities for customer devices and systems.
Kandou offers fundamental advances in interconnect technology that lower the power consumed and improve performance of chip links, unlocking new capabilities for customer devices and systems.
Kandou is backed by Bessemer Venture Partners, Swisscom Ventures,, Forestay Capital, Climb Ventures, Swiss Select Opportunities, Columbia Lake Partners, Digital Transformation Fund, Fayerweather Capital Partners and others. The company raised an additional $36.3M to its Series C round on Nov 17, 2020, brining the round total to $92.3M. This additional financing brings Kandou's total funding to $132.4M to date.