ESWIN is a semiconductor products and services supplier, with its core businesses in IC and Solutions, Silicon Materials, Advanced Packaging and Testing.

ESWIN provides high-quality monocrystalline silicon polished wafers and epitaxial wafers for ICs, which are widely used in electronic communication, automobile manufacturing, artificial intelligence, consumer electronics and other fields.

ESWIN was founded in 2016 by Wang Dongsheng. The company is headquartered in Beijing, China.

Eswin makes monocrystalline silicon polished wafers and epitaxial wafers for ICs and performs IC packaging and testing of materials and finished chips with bases in Suzhou, Hefei and Chengdu.

Eswin Computing develops integrated chips and solutions focused on displays and videos, AI data processing and wireless connection. It also offers advanced packaging and testing solutions.

ESWIN also operates as a fabless chip company developing display driver ICs. It retains a strong relationship with BOE, which has reportedly been responsible for 37 percent of Eswin’s chip business revenue.

ESWIN is backed by IDG Capital, Goldstone Investment, Lighthouse Capital, China Internet Investment Fund, SAIC Capital, InnoVision Capital, Legend Capital, Riverhead Capital Investment Management, CDB Capital, and others. The company raised 2.5bn yuan ($392.4M) in Series C round on Dec 01, 2021. This brings ESWIN's total funding to $1.1B to date.